Ultra-small diameter through-hole substrate with 4-layer filled blind vias.
Formation of through holes with a diameter of 25μm or less. Since components can be mounted on top of the vias, space-saving is achieved.
The "Ultra-small diameter through hole" is a flexible substrate designed to have holes filled by 15μm through-hole plating. It is possible to form through holes with a diameter of 25μm or less on double-sided flexible substrates. Additionally, we also offer "4-layer filled blind vias," which allow for the filling of blind vias through plating on 4-layer flexible substrates. 【Specifications】 〈Ultra-small diameter through hole〉 ■ Base polyimide: 50μm ■ Conductor thickness: 12μm ■ Hole diameter (entry side): φ20μm ■ Hole diameter (exit side): φ15μm ■ Land diameter: 95μm *For more details, please refer to the PDF document or feel free to contact us.
